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    10.04 : 전자

  • ASTM E2544-11A

    Terminology for:Three-Dimensional (3D) Imaging Systems
  • ASTM E2641-09

    Practice for:Best Practices for Safe Application of 3D Imaging Technology
  • ASTM E2807-11

    Specification for:3D Imaging Data Exchange, Version 1.0
  • ASTM E2919-14

    Test Method for:Evaluating the Performance of Systems that Measure Static, Six Degrees of Freedom (6DOF), Pose
  • ASTM E2938-15

    Test Method for:Evaluating the Relative-Range Measurement Performance of 3D Imaging Systems in the Medium Range
  • ASTM F0007-95R11

    Specification for:Aluminum Oxide Powder
  • ASTM F0015-04R13

    Specification for:Iron-Nickel-Cobalt Sealing Alloy
  • ASTM F0016-12

    Test Methods for:Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps
  • ASTM F0018-12

    Specification and Test Method for:Evaluation of Glass-to-Metal Headers Used in Electron Devices
  • ASTM F0019-11

    Test Method for:Tension and Vacuum Testing Metallized Ceramic Seals
  • ASTM F0029-97R12

    Specification for:Dumet Wire for Glass-to-Metal Seal Applications
  • ASTM F0030-96R12

    Specification for:Iron-Nickel Sealing Alloys
  • ASTM F0031-12

    Specification for:Nickel-Chromium-Iron Sealing Alloys
  • ASTM F0044-95R11

    Specification for:Metallized Surfaces on Ceramic
  • ASTM F0072

    Specification for: Gold Wire for Semiconductor Lead Bonding
  • ASTM F0073-96R13

    Specification for:Tungsten-Rhenium Alloy Wire for Electron Devices and Lamps
  • ASTM F0076-08

    Test Methods for:Measuring Resistivity and Hall Coefficient and Determining Hall Mobility in Single-Crystal Semiconductors
  • ASTM F0083-71R13

    Practice for:Definition and Determination of Thermionic Constants of Electron Emitters
  • ASTM F0085-76R13

    Practice for:Nomenclature for Wire Leads Used as Conductors in Electron Tubes
  • ASTM F0096-77R15

    Specification for:Electronic Grade Alloys of Copper and Nickel in Wrought Forms
  • ASTM F0106-12

    Specification for:Brazing Filler Metals for Electron Devices
  • ASTM F0180-94R15

    Test Method for:Density of Fine Wire and Ribbon Wire for Electronic Devices
  • ASTM F0204-76R13

    Test Method for:Surface Flaws in Tungsten Seal Rod and Wire
  • ASTM F0205-94R15

    Test Method for:Measuring Diameter of Fine Wire by Weighing
  • ASTM F0219-96R13

    Test Methods of Testing:Fine Round and Flat Wire for Electron Devices and Lamps
  • ASTM F0256-05R15

    Specification for:Chromium-Iron Sealing Alloys with 18 or 28 Percent Chromium
  • ASTM F0269-60R14

    Test Method for:Sag of Tungsten Wire
  • ASTM F0288-96R14

    Specification for:Tungsten Wire for Electron Devices and Lamps
  • ASTM F0289-96R14

    Specification for:Molybdenum Wire and Rod for Electronic Applications
  • ASTM F0290-94R15

    Specification for:Round Wire for Winding Electron Tube Grid Laterals
  • ASTM F0364-96R14

    Specification for:Molybdenum Flattened Wire for Electron Tubes
  • ASTM F0375-89R15

    Specification for:Integrated Circuit Lead Frame Material
  • ASTM F0390-11

    Test Method for:Sheet Resistance of Thin Metallic Films With a Collinear Four-Probe Array
  • ASTM F0448-11

    Test Method for:Measuring Steady-State Primary Photocurrent
  • ASTM F0458-13

    Practice for:Nondestructive Pull Testing of Wire Bonds
  • ASTM F0459-13

    Test Methods for:Measuring Pull Strength of Microelectronic Wire Bonds
  • ASTM F0487-13

    Specification for:Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding
  • ASTM F0584

    Practice for:Visual Inspection of Semiconductor Lead-Bonding Wire
  • ASTM F0615M-95R13

    Practice for:Determining Safe Current Pulse-Operating Regions for Metallization on Semiconductor Components (Metric)
  • ASTM F0744M-10

    Test Method for:Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits (Metric)
  • ASTM F0773M-10

    Practice for:Measuring Dose Rate Response of Linear Integrated Circuits (Metric)
  • ASTM F0980-10E01

    Guide for:Measurement of Rapid Annealing of Neutron-Induced Displacement Damage in Silicon Semiconductor Devices
  • ASTM F0996-11

    Test Method for:Separating an Ionizing Radiation-Induced MOSFET Threshold Voltage Shift Into Components Due to Oxide Trapped Holes and Interface States Using the Subthreshold Current–Voltage Characteristics
  • ASTM F1094-87R12

    Test Methods for:Microbiological Monitoring of Water Used for Processing Electron and Microelectronic Devices by Direct Pressure Tap Sampling Valve and by the Presterilized Plastic Bag Method
  • ASTM F1190-11

    Guide for:Neutron Irradiation of Unbiased Electronic Components
  • ASTM F1192-11

    Guide for the:Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices
  • ASTM F1238-95R11

    Specification for:Refractory Silicide Sputtering Targets for Microelectronic Applications
  • ASTM F1262M-14

    Guide for:Transient Radiation Upset Threshold Testing of Digital Integrated Circuits (Metric)
  • ASTM F1263-11

    Guide for:Analysis of Overtest Data in Radiation Testing of Electronic Parts
  • ASTM F1269-13

    Test Methods for:Destructive Shear Testing of Ball Bonds
  • ASTM F1367-98R11

    Specification for:Chromium Sputtering Targets for Thin Film Applications
  • ASTM F1372-93R12

    Test Method for:Scanning Electron Microscope (SEM) Analysis of Metallic Surface Condition for Gas Distribution System Components
  • ASTM F1373-93R12

    Test Method for:Determination of Cycle Life of Automatic Valves for Gas Distribution System Components
  • ASTM F1374-92R12

    Test Method for:Ionic/Organic Extractables of Internal Surfaces-IC/GC/FTIR for Gas Distribution System Components
  • ASTM F1375-92R12

    Test Method for:Energy Dispersive X-Ray Spectrometer (EDX) Analysis of Metallic Surface Condition for Gas Distribution System Components
  • ASTM F1376-92R12

    Guide for:Metallurgical Analysis for Gas Distribution System Components
  • ASTM F1394-92R12

    Test Method for:Determination of Particle Contribution from Gas Distribution System Valves
  • ASTM F1396-93R12

    Test Method for:Determination of Oxygen Contribution by Gas Distribution System Components
  • ASTM F1397-93R12

    Test Method for:Determination of Moisture Contribution by Gas Distribution System Components
  • ASTM F1398-93R12

    Test Method for:Determination of Total Hydrocarbon Contribution by Gas Distribution System Components
  • ASTM F1438-93R12

    Test Method for:Determination of Surface Roughness by Scanning Tunneling Microscopy for Gas Distribution System Components
  • ASTM F1466-99R15

    Specification for:Iron-Nickel-Cobalt Alloys for Metal-to-Ceramic Sealing Applications
  • ASTM F1467-11

    Guide for:Use of an X-Ray Tester (≈10 keV Photons) in Ionizing Radiation Effects Testing of Semiconductor Devices and Microcircuits
  • ASTM F1512-94R11

    Practice for:Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies
  • ASTM F1513-99R11

    Specification for:Pure Aluminum (Unalloyed) Source Material for Electronic Thin Film Applications
  • ASTM F1578-07R14

    Test Method for:Contact Closure Cycling of a Membrane Switch
  • ASTM F1593-08

    Test Method for:Trace Metallic Impurities in Electronic Grade Aluminum by High Mass-Resolution Glow-Discharge Mass Spectrometer
  • ASTM F1594-95R11

    Specification for:Pure Aluminum (Unalloyed) Source Material for Vacuum Coating Applications
  • ASTM F1595-00R12

    Practice for:Viewing Conditions for Visual Inspection of Membrane Switches
  • ASTM F1596-15

    Test Method for:Exposure of a Membrane Switch or Printed Electronic Device to Temperature and Relative Humidity
  • ASTM F1598-95R14

    Test Method:for Determining the Effects of Chemical/Solvent Exposure to a Membrane Switch/Graphic Overlay (Spot Test Method)
  • ASTM F1661-09R15

    Test Method for:Determining the Contact Bounce Time of a Membrane Switch
  • ASTM F1662-10

    Test Method for:Verifying the Specified Dielectric Withstand Voltage and Determining the Dielectric Breakdown Voltage of a Membrane Switch
  • ASTM F1663-15

    Test Method for:Determining the Capacitance of a Membrane Switch or Printed Electronic Device
  • ASTM F1680-07AR14

    Test Method for:Determining Circuit Resistance of a Membrane Switch
  • ASTM F1681-14

    Test Method for:Determining Current Carrying Capacity of a Membrane Switch Circuit
  • ASTM F1683-09

    Practice for:Creasing or Bending a Membrane Switch, Membrane Switch Flex Tail Assembly or Membrane Switch Component
  • ASTM F1684-06R11

    Specification for:Iron-Nickel and Iron-Nickel-Cobalt Alloys for Low Thermal Expansion Applications
  • ASTM F1689-05R12

    Test Method for:Determining the Insulation Resistance of a Membrane Switch
  • ASTM F1709-97R08

    Specification for:High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
  • ASTM F1710-08

    Test Method for:Trace Metallic Impurities in Electronic Grade Titanium by High Mass-Resolution Glow Discharge Mass Spectrometer
  • ASTM F1711-96R08

    Practice for:Measuring Sheet Resistance of Thin Film Conductors for Flat Panel Display Manufacturing Using a Four-Point Probe Method
  • ASTM F1761-00R11

    Test Method for:Pass Through Flux of Circular Magnetic Sputtering Targets
  • ASTM F1762-14

    Test Method for:Determining the Effects of Atmospheric Pressure Variation on a Membrane Switch
  • ASTM F1812-15

    Test Method for:Determining the Effect of an ESD Discharge on a Membrane Switch or Printed Electronic Device
  • ASTM F1842-15

    Test Method for:Determining Ink or Coating Adhesion on Flexible Substrates for a Membrane Switch or Printed Electronic Device
  • ASTM F1843-15

    Practice for:Sample Preparation of Plastic Films used on Membrane Switch Overlays for Specular Gloss Measurements
  • ASTM F1844-97R08

    Practice for:Measuring Sheet Resistance of Thin Film Conductors For Flat Panel Display Manufacturing Using a Noncontact Eddy Current Gage
  • ASTM F1845-08

    Test Method for:Trace Metallic Impurities in Electronic Grade Aluminum-Copper, Aluminum-Silicon, and Aluminum-Copper-Silicon Alloys by High-Mass-Resolution Glow Discharge Mass Spectrometer
  • ASTM F1892-12

    Guide for:Ionizing Radiation (Total Dose) Effects Testing of Semiconductor Devices
  • ASTM F1893-11

    Guide for:Measurement of Ionizing Dose-Rate Survivability and Burnout of Semiconductor Devices
  • ASTM F1894-98R11

    Test Method for:Quantifying Tungsten Silicide Semiconductor Process Films for Composition and Thickness
  • ASTM F1895-14

    Test Method for:Submersion of a Membrane Switch
  • ASTM F1896-10

    Test Method for:Determining the Electrical Resistivity of a Printed Conductive Material
  • ASTM F1995-13

    Test Method for:Determining the Shear Strength of the Bond between a Surface Mount Device (SMD) and Substrate in a Membrane Switch
  • ASTM F1996-14

    Test Method for:Silver Migration for Membrane Switch Circuitry
  • ASTM F2072-14

    Test Method for:Hosedown of a Membrane Switch
  • ASTM F2073-14

    Test Method for:Non-Destructive Short Circuit Testing of a Membrane Switch
  • ASTM F2112-02R11

    Terminology for:Membrane Switches
  • ASTM F2113-01R11

    Guide for:Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications
  • ASTM F2187-02R11

    Test Method for:Determining the Effect of Random Frequency Vibration on a Membrane Switch or Membrane Switch Assembly
  • ASTM F2188-02R11

    Test Method for:Determining the Effect of Variable Frequency Vibration on a Membrane Switch or Membrane Switch Assembly
  • ASTM F2357-10

    Test Method for:Determining the Abrasion Resistance of Inks and Coatings on Membrane Switches Using the Norman Tool “RCA” Abrader,
  • ASTM F2359-04R11

    Test Method for:Determining Color of a Membrane Switch Backlit with Diffuse Light Source
  • ASTM F2360-08R15E01

    Test Method for:Determining Luminance of a Membrane Switch Backlit with Diffuse Light Source
  • ASTM F2405-04R11

    Test Method for:Trace Metallic Impurities in High Purity Copper by High-Mass-Resolution Glow Discharge Mass Spectrometer
  • ASTM F2576-15A

    Terminology Relating to:Declarable Substances in Materials
  • ASTM F2577-14

    Guide for:Assessment of Materials and Products for Declarable Substances
  • ASTM F2592-10

    Test Method for:Measuring the Force-Displacement of a Membrane Switch
  • ASTM F2617-15

    Test Method for:Identification and Quantification of Chromium, Bromine, Cadmium, Mercury, and Lead in Polymeric Material Using Energy Dispersive X-ray Spectrometry
  • ASTM F2725-11

    Guide for:European Union's Registration, Evaluation, and Authorization of Chemicals (REACH) Supply Chain Information Exchange
  • ASTM F2749-15

    Test Method for:Determining the Effects of Creasing a Membrane Switch or Printed Electronic Device
  • ASTM F2750-09

    Test Method for:Determining the Effects of Bending a Membrane Switch or Assembly
  • ASTM F2771-10

    Test Method for:Determining the Luminance Curve of an Electroluminescent Lamp at Ambient Conditions
  • ASTM F2792

    Terminology for:Additive Manufacturing Technologies
  • ASTM F2853-10R15

    Test Method for:Determination of Lead in Paint Layers and Similar Coatings or in Substrates and Homogenous Materials by Energy Dispersive X-Ray Fluorescence Spectrometry Using Multiple Monochromatic Excitation Beams
  • ASTM F2865-13

    Guide for:Classifying the Degrees of Ingress of Dust and Water into a Membrane Switch
  • ASTM F2866-11

    Test Method for:Flammability of a Membrane Switch in Defined Assembly
  • ASTM F2915-13

    Specification for:Additive Manufacturing File Format (AMF) Version 1.1
  • ASTM F2921-13

    Terminology for:Additive Manufacturing—Coordinate Systems and Test Methodologies
  • ASTM F2924-14

    Specification for:Additive Manufacturing Titanium-6 Aluminum-4 Vanadium with Powder Bed Fusion
  • ASTM F2931-15

    Guide for:Analytical Testing of Substances of Very High Concern in Materials and Products
  • ASTM F2964-12

    Test Method for:Determining the Uniformity of the Luminance of an Electroluminescent Lamp or Other Diffuse Lighting Device
  • ASTM F2971-13

    Practice for:Reporting Data for Test Specimens Prepared by Additive Manufacturing
  • ASTM F2980-13

    Test Method for:Analysis of Heavy Metals in Glass by Field Portable X-Ray Fluorescence (XRF)
  • ASTM F3001-14

    Specification for:Additive Manufacturing Titanium-6 Aluminum-4 Vanadium ELI (Extra Low Interstitial) with Powder Bed Fusion
  • ASTM F3049-14

    Guide for:Characterizing Properties of Metal Powders Used for Additive Manufacturing Processes
  • ASTM F3055-14A

    Specification for:Additive Manufacturing Nickel Alloy (UNS N07718) with Powder Bed Fusion
  • ASTM F3056-14E01

    Specification for:Additive Manufacturing Nickel Alloy (UNS N06625) with Powder Bed Fusion
  • ASTM F3078-15

    Test Method for:Identification and Quantification of Lead in Paint and Similar Coating Materials using Energy Dispersive X-ray Fluorescence Spectrometry (EDXRF)
  • ASTM F3091_F3091M-14

    Specification for:Powder Bed Fusion of Plastic Materials
  • ASTM F3122-14

    Guide for:Evaluating Mechanical Properties of Metal Materials Made via Additive Manufacturing Processes
  • ASTM F3139-15

    Test Method for:Analysis of Tin-Based Solder Alloys for Minor and Trace Elements Using Inductively Coupled Plasma Atomic Emission Spectrometry
  • ASTM F3147-15

    Test Method for:Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend
  • ASTM F3152-15

    Test Method for:Determining Abrasion Resistance of Inks and Coatings on Substrates Using Norman Tool “WA-1010 Wet Abrader”
  • ASTM F3177-15

    Terminology for:Additive Manufacturing – General Principles – Terminology