한국표준정보망

KS I ISO 21438-2

Workplace atmospheres ― Determination of inorganic acids by ion chromatography ― Part 2: Volatile acids, except hydrofluoric acid(hydrochloric acid, hydrobromic acid and nitric acid)

KS I ISO 17734-2

Determination of organonitrogen compounds in air using liquid chromatography and mass spectrometry — Part 2: Amines and aminoisocyanates using dibutylamine and ethyl chloroformate derivatives

KS I ISO 11174

Workplace air ― Determination of particulate cadmium and cadmium compounds ― Flame and electrothermal atomic absorption spectrometric method

KS I ISO 17737

Workplace atmoshperes — Guidelines for selecting analytical methods for sampling and analysing isocyanates in air

KS I ISO 15202-1

Workplace air — Determination of metals and metalloids in airborne particulate matter by inductively coupled plasma atomic emission spectrometry — Part 1: Sampling

KS I ISO 21438-1

Workplace atmospheres — Determination of inorganic acids by ion chromatography — Part 1: Non-volatile acids (sulfuric acid and phosphoric acid)

KS I ISO 17734-1

Determination of organonitrogen compounds in air using liquid chromatography and mass spectrometry — Part 1: Isocyanates using dibutylamine derivatives

KS I ISO 15202-2

Workplace air — Determination of metals and metalloids in airborne particulate matter by inductively coupled plasma atomic emission spectrometry — Part 2: Sample preparation

KS M 3871-1

Rigid cellular plastics — Spray-applied polyurethane foam for thermal insulation — Part 1: Material specifications

KS Q ISO 10013

Quality management systems — Guidance for documented information

KS M 3871-3

Rigid cellular plastics — Spray-applied polyurethane foam for thermal insulation — Part 3: Test methods

KS Q ISO 10015

Quality management — Guidelines for competence management and people development

KS A ISO GUIDE 84

Guidelines for addressing climate change in standards

KS C IEC 61189-2-630

Test methods for electrical materials, printed board and other interconnection structures and assemblies — Part 2-630: Test methods for materials for interconnection structures — Moisture absorption after pressure vessel conditioning

KS C IEC 63068-4

Semiconductor devices — Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices — Part 4: Procedure for identifying and evaluating defects using a combined method of optical inspection and photoluminescence

KS C IEC 63068-2

Semiconductor devices — Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices — Part 2: Test method for defects using optical inspection

KS C IEC 61188-6-2

Circuit boards and circuit board assemblies — Design and use — Part 6-2: Land pattern design — Description of land pattern for the most common surface mounted components (SMD)

KS C IEC 63229

Semiconductor devices — Classification of defects in gallium nitride epitaxial film on silicon carbide substrate