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IEC 60749-30:2020 RLV

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
- 발행일 : 2020-08-17
- 발행기관 : IEC
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* RLV (Red-Line Version) : 구판과 최신판의 변경 사항을 빨간펜으로 표시해서 비교할 수 있게 만든 버전
* CMV (Commented version) : 표준의 개정 시 변경 부분(레드라인)에 대한 코멘트(메모)가 추가된 버전
* RLV 혹은 CMV를 구입하시면 최신판(Final version)은 별도로 구매하지 않아도 됩니다.

분야
적용범위	IEC 60749-30:2020 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This edition includes the following significant technical changes with respect to the previous edition: - inclusion of new Clause 3; - expansion of 6.7 on solder reflow; - inclusion of explanatory notes and clarifications.
국제분류(ICS)코드	31.080.01 : 반도체 장치 일반
페이지수	41
Edition	2.0

No.	표준번호	표준명	발행일	상태
1	IEC 60749-30:2020상세보기	Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing	2020-08-17	표준
2	IEC 60749-30:2020 RLV상세보기	Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing	2020-08-17	표준
3	IEC 60749-30:2005+AMD1:2011 CSV상세보기	Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing	2011-08-10	구판
4	IEC 60749-30:2005/AMD1:2011상세보기	Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing	2011-05-25	구판
5	IEC 60749-30:2005상세보기	Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing	2005-01-20	구판