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적용범위 | IEC 60749-5:2023 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition: a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test; b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment; c) replacement of references to “virtual junction” with “die”. |
국제분류(ICS)코드 | 31.080.01 : 반도체 장치 일반 |
페이지수 | 26 |
Edition | 3.0 |
No. | 표준번호 | 표준명 | 발행일 | 상태 |
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1 | IEC 60749-5:2023 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test | 2023-12-19 | 표준 |
2 | IEC 60749-5:2023 RLV | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test | 2023-12-19 | 표준 |
3 | IEC 60749-5:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test | 2017-04-10 | 구판 |
4 | IEC 60749-5:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test | 2003-01-17 | 구판 |
IEC 60749-11:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method 상세보기
IEC 60749-2:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure 상세보기
IEC 60749-32:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) 상세보기
IEC 60749-31:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced) 상세보기
IEC 60749-1:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 1: General 상세보기
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